Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer

Product Details
Customization: Available
Application: Semi Standard
Material: Compound Semiconductor
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  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
  • Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
12inch
Growth Method
CZ
Crystal Orientation
100
Dopant
Boron
Resistivity
1-100Ω
Frront Side
Polished
Edge
Polished
Diameter
300±0.2mm
Thickness
775±25μm
Transport Package
Semi Standard
Specification
TBD
Trademark
FSM
Origin
China
HS Code
3818001920
Production Capacity
5000PCS/Month

Product Description

Product Description
 

Why Choose FSM?

  • Expertise : With a team of seasoned professionals and cutting-edge manufacturing facilities, we ensure the consistent delivery of high-quality wafers.
  • Wide Range of Products : From advanced Czochralski (CZ) and Float Zone (FZ) silicon wafers to sophisticated SOI and glass wafers, our extensive selection caters to your specific needs.
  • Customization : We excel in creating custom wafers tailored to your exact specifications, guaranteeing the success of your project.
  • Fast Turnaround : Our efficient processes and readily available inventory allow us to deliver swiftly, ensuring your projects remain on schedule.
  • Global Reach : With warehouses in China and Japan, we serve customers in over 50 countries, providing worldwide shipping.
Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Dummy wafers (also known as test wafers) are primarily used for experiments and testing, differing from standard production wafers.
Accordingly, reclaimed wafers are predominantly utilized as dummy wafers (test wafers).

Dummy wafers are frequently employed in production devices to enhance safety at the start of the production process and are used for delivery checks and process evaluations.
As dummy wafers are often used for experiments and testing, their size and thickness are crucial factors in most scenarios.
Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide WaferAdvanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Wafers processed with film deposition are referred to as film wafers.
Examples of films used (film growth) include isolation films for layer separation, metal films for conductivity, and process materials such as resists and protective films.
Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide WaferAdvanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Product Parameters
 

Reference Values for Optimal Use

Item Specification
Diameter 150mm 200mm 300mm
Type P/N P/N P/N
Notch SEMI/JEIDA Notch/OF Notch
Thickness(μm) 675±25/625±25 725±25 725±25
Surface Polished Polished Polished
Inside Etched Etched Etched
Package CoinRoll CoinRoll CoinRoll
 

150MM/200MM Test Wafer - Precision Engineered for High Performance

150MM
SPEC 0.2um≤30ea
Diameter(mm) 150±0.2mm
Type P
Olyfra length 57.5mm±2.5mm 47.5mm±2.5mm
Resistance value ( Ω·cm ) 1-100
Thickness(μm) SEMI JEIDA
675um±25um 675um±25um
TTV(μm) ≤30um
BOW(μm) ≤40um
WARP(μm) ≤40um
Surface impurity ≤5.0E 10 atom/cm²
 
200MM
SPEC 0.2um≤30ea -
Diameter(mm) 200±0.2mm
Type P
Crystal orientation <110>±1
Notch direction
Resistance value ( Ω·cm ) 1-100
Thickness(μm) 725um±25um
TTV(μm) ≤25um ≤2um
BOW(μm) ≤40um
WARP(μm)
LM NO
Surface impurity ≤5.0E 10 atom/cm²
 
300MM Test Wafer - Exceptional Quality for Advanced Testing Needs
300MM
SPEC 0.045um≤50ea 0.065um≤50ea 0.09um<50ea 0.12um<50ea
Manufacturing method CZ
Diameter(mm) 300±0.2mm
Type/Dopant P/Boron
Crystal orientation <100>±1
Notch direction
Resistance value (Ω·cm) 1-100
Thickness(μm) 775±25
TTV(μm) ≤10
BOW(μm) ≤40
WARP(μm)
LM T7+ OCR
Surface impurity <1 E10 Atoms/cm²
 
200MM/300MM Oxide Wafer - Superior Stability and Performance
 
  200MM 300MM
Oxide thickness 500±25nm
Variation in oxide thickness
(for one wafer)
<3%
Variation in oxide thickness
(for multiple wafers)
<3%
SPEC 0.2μm≤30ea
Diameter(mm) 200±0.2mm 300±0.2mm
Type P
Crystal orientation <100>±1
Notch direction <100>±1
Resistance value (Ω ·cm) 1-100
Thickness(μm) 725±25
TTV(μm) ≤25 ≤10
BOW(μm) ≤40
WARP(μm) ≤40
Surface impurity ≤5.0 E10 Atom/cm² <1 E10 Atoms/cm²
 
* For details on other film types, thickness, and composition, please contact us. We're here to customize your requirements.

At FSM, we offer the highest quality silicon wafers at competitive prices. Silicon wafers are the cornerstone of modern semiconductor technology. Our WaferPro silicon wafers strike the perfect balance of cost-effectiveness and high performance.

Whether you need silicon wafers for immediate purchase or prefer to shop online, our inventory includes SEMI standard silicon wafers in sizes of 2", 3", 100mm, 125mm, 150mm, 200mm, and 300mm, ready for prompt shipping.

For custom wafer sizes or specialized specifications beyond our standard online offerings, reach out to our dedicated team to meet your unique semiconductor wafer needs through our vast network of supply chain partnerships.

Certifications

Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Packaging & Shipping

Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Company Profile
 
Established in August 2008, Fine Silicon Manufacturing (Shanghai) Ltd. has revolutionized the silicon wafer industry. Nestled in the dynamic Shanghai Pudong New Area, our state-of-the-art wafer reclaim factory boasts unparalleled capabilities, specifically in lapping and polishing 6-12 inch wafers. With a robust capacity of 50,000 pieces per month, we guarantee efficiency and quality. Our expertise extends beyond this; we are also premier agents for particle-controlled test wafer reclamation, advanced wafer film coating, and precision wafer thinning services. Intrigued by our offerings? Please CONTACT US for more detailed information.
Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
 
 
Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
Our Advantages

Advanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide WaferAdvanced CZ Method Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer
FAQ
 

Q: What are the available shipping methods?
A: We offer a range of shipping options including DHL, FedEx, ***, UPS, EMS, SF, and more.
Q: What payment methods do you accept?
A: We accept payments via T/T and PayPal,as well as other methods.
Q: What is the delivery time?
A: For in-stock items, delivery time is typically 5 business days.
For customized products, delivery times range from 7 to 25 business days, depending on the order quantity.
Q: Can I request customizations based on my specific needs?
A: Absolutely! We can tailor the material, specifications, and optical coating of your optical components to meet your unique requirements.

Every customer's specifications are unique, and Fine Silicon Manufacturing (Shanghai) Ltd. can supply wafers that meet your exact needs.

If you do not find the specifications you need, please
to speak with a member of our experienced and knowledgeable sales team.

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