Advanced Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Technology

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : At Fine Silicon Manufacturing (Shanghai) Ltd., we pride ourselves on employing a team of seasoned industry professionals. Coupled with our cutting-edge manufacturing facilities, we ensure the delivery of wafers that meet the highest standards of quality and precision.
• Wide Range of Products : Whether you need Czochralski (CZ) and Float Zone (FZ) silicon wafers, SOI, or glass wafers, our extensive portfolio is designed to cater to your diverse requirements with accuracy and reliability.
• Customization : We excel in producing customized wafers tailored to your precise specifications, enhancing the success of your projects with precision-engineered solutions.
• Fast Turnaround : Thanks to our efficient processes and well-stocked inventory, we guarantee swift delivery, helping you adhere to tight project timelines with ease.
• Global Reach : With strategic warehouses in China and Japan, we are equipped to serve over 50 countries, ensuring our global clientele receives unparalleled service and delivery.

Dummy wafers, also known as test wafers, are primarily utilized for experimentation and testing, distinguishing them from standard wafers used in final products.
Consequently, reclaimed wafers find their main application as dummy wafers, effectively serving in testing environments.

In production settings, dummy wafers are frequently employed at the outset to enhance safety, as well as for process verification and delivery evaluations.
Given their role in experiments and testing, the dimensions and thickness of dummy wafers are critical factors that demand careful consideration.

Wafers subjected to film deposition processes are referred to as film wafers.
Film types include isolation films for layer separation, metal films for conductivity, and various processing materials like resist and protective films, essential for diverse applications.

Product Parameters

 

Use reference value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For inquiries about additional film types, varying film thicknesses, or specific film compositions tailored to your needs, please contact us directly.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd., established in the vibrant August of 2008, is a trailblazer in the realm of silicon technology. Nestled in the bustling Shanghai Pudong New Area, we proudly present our state-of-the-art wafer reclaim factory. Here, we specialize in the meticulous lapping and polishing of wafers ranging from 6-12 inches, boasting an impressive monthly capacity of 50K pieces. In addition, we serve as a dedicated agent for particle-controlled test wafers reclaiming, as well as the sophisticated processes of wafer film coating and wafer thinning. If your interests align with the future of silicon technology, we cordially invite you to CONTACT US for more comprehensive insights.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping methods?
A: We proudly offer a range of trusted shipping options including DHL, FedEx, TNT, UPS, EMS, and SF, among others.
Q: What are the payment methods available?
A: We provide flexible payment solutions including T/T and PayPal, along with other convenient options.
Q: What is the expected delivery time?
A: For items in stock, you can expect delivery within 5 workdays.
For customized orders, the delivery timeline ranges from 7 to 25 workdays, contingent upon order quantity.
Q: Is product customization available to suit my specific requirements?
A: Absolutely, we specialize in tailoring the material, specifications, and optical coating of your optical components to meet your precise needs.

Recognizing the uniqueness of each project, FSM is committed to delivering wafers that fulfill your exact requirements.

Should you not find the specifications you are looking for, please don't hesitate to CONTACT FSMto connect with our adept and insightful sales team, ready to assist you.