Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Bulk Purchase

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a team of seasoned experts and cutting-edge manufacturing facilities, Fine Silicon Manufacturing(Shanghai)Ltd. consistently delivers wafers of the highest quality.
• Wide Range of Products : We offer an extensive selection of wafers ranging from Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, ensuring you find precisely what you need for your applications.
• Customization : Our expertise in custom wafer manufacturing allows us to tailor products to your precise specifications, ensuring the success of your unique projects.
• Fast Turnaround : Thanks to our efficient processes and ready inventory, we offer rapid delivery, ensuring your projects progress without delay.
• Global Reach : With shipping capabilities from our China and Japan warehouses, we proudly serve customers in over 50 countries worldwide.

Dummy wafers, also known as test wafers, are primarily utilized for experimental and testing purposes, differing from standard production wafers.
Reclaimed wafers find their primary application as dummy wafers (test wafers), meeting specific testing needs.

In production, dummy wafers enhance safety at the start of the manufacturing process and are crucial for delivery verification and process evaluation.
Given their experimental and testing roles, the size and thickness of dummy wafers are critical considerations in most scenarios.

Wafers enhanced by film deposition are termed film wafers.
Film examples used in growth include isolation films for layer separation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Use Reference Value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer: Our precision-engineered test wafers in 150MM and 200MM sizes offer unparalleled quality, designed to elevate your testing processes to the next level.

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer: Experience the advanced reliability and efficiency of our 300MM test wafers, tailored to meet the highest standards of the industry.

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer: Discover the excellence of our oxide wafers available in 200MM and 300MM, crafted to deliver superior performance in diverse applications.
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For inquiries on other film types, film thickness, and film composition, please reach out to us. Our team is eager to assist and provide customized solutions for your specific needs.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd., founded in the vibrant month of August 2008, stands as a beacon of innovation in the heart of Shanghai's Pudong New Area. Our state-of-the-art wafer reclaim facility is a testament to our commitment to excellence, specializing in the meticulous lapping and polishing of 6 to 12-inch wafers. With an impressive capacity of 50,000 pieces per month, we set the standard in the industry. In addition, we proudly serve as agents for particle-controlled test wafer reclaim, advanced wafer film coating, and precise wafer thinning services. Intrigued by our offerings? We warmly invite you to CONTACT US for further insights and collaborations.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping methods?
A: We accommodate various shipping options including DHL, FedEx, TNT, UPS, EMS, SF, among others.
Q: What payment methods are available?
A: We accept T/T (Telegraphic Transfer) and PayPal. Additional payment methods may also be available.
Q: What is the delivery timeframe?
A: For in-stock items, the delivery time is approximately 5 working days.
For customized products, delivery ranges from 7 to 25 working days, depending on the quantity ordered.
Q: Is product customization available?
A: Absolutely, we offer customization of material, specifications, and optical coating to suit your specific needs.

Every customer's requirements are unique, and Fine Silicon Manufacturing ensures wafers meet your precise specifications.

If the specifications you need aren't listed, please CONTACT FSMto consult with our expert and dedicated sales team.