Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method

Product Details
Customization: Available
Application: Semi Standard
Material: Compound Semiconductor
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  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
  • Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
12inch
Resistivity
1-100Ω
Frront Side
Polished
Edge
Polished
Diameter
300±0.2mm
Thickness
775±25μm
Transport Package
Semi Standard
Specification
TBD
Trademark
FSM
Origin
China
HS Code
3818001920
Production Capacity
5000PCS/Month

Product Description

Product Description
 

Why Choose FSM?

  • Expertise : With a team of seasoned professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
  • Wide Range of Products : From Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, our extensive selection ensures we can meet your specific needs.
  • Customization : We excel in producing custom wafers tailored to your precise specifications, guaranteeing the success of your project.
  • Fast Turnaround : With our optimized processes and in-stock inventory, we offer rapid delivery to keep your projects on schedule.
  • Global Reach : Shipping from our China and Japan warehouses, we serve customers in over 50 countries worldwide.
Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Dummy wafers (also known as test wafers) are primarily utilized for experiments and testing, differing from standard wafers intended for products.
Consequently, reclaimed wafers are predominantly used as dummy wafers (test wafers).

Dummy wafers are frequently employed in production devices to enhance safety at the start of the production process, as well as for delivery checks and process evaluations.
Given their use in experiments and testing, the size and thickness of dummy wafers are crucial factors.
Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth MethodSilicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Wafers processed with film deposition are termed film wafers.
Examples of films used (film growth) include isolation films for layer separation, metal films for conductivity, and process materials like resist and protective films.
Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth MethodSilicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Product Parameters
 

Usage Reference Value

Item Specification
Diameter 150mm 200mm 300mm
Type P/N P/N P/N
Notch SEMI/JEIDA Notch/OF Notch
Thickness(μm) 675±25/625±25 725±25 725±25
Surface Polished Polished Polished
Inside Etched Etched Etched
Package CoinRoll CoinRoll CoinRoll
 

150MM/200MM High-Precision Test Wafer

150MM
SPEC 0.2um≤30ea
Diameter(mm) 150±0.2mm
Type P
Olyfra length 57.5mm±2.5mm 47.5mm±2.5mm
Resistance value ( Ω·cm ) 1-100
Thickness(μm) SEMI JEIDA
675um±25um 675um±25um
TTV(μm) ≤30um
BOW(μm) ≤40um
WARP(μm) ≤40um
Surface impurity ≤5.0E 10 atom/cm²
 
200MM
SPEC 0.2um≤30ea -
Diameter(mm) 200±0.2mm
Type P
Crystal orientation <110>±1
Notch direction
Resistance value ( Ω·cm ) 1-100
Thickness(μm) 725um±25um
TTV(μm) ≤25um ≤2um
BOW(μm) ≤40um
WARP(μm)
LM NO
Surface impurity ≤5.0E 10 atom/cm²
 
300MM High-Precision Test Wafer
300MM
SPEC 0.045um≤50ea 0.065um≤50ea 0.09um<50ea 0.12um<50ea
Manufacturing method CZ
Diameter(mm) 300±0.2mm
Type/Dopant P/Boron
Crystal orientation <100>±1
Notch direction
Resistance value (Ω·cm) 1-100
Thickness(μm) 775±25
TTV(μm) ≤10
BOW(μm) ≤40
WARP(μm)
LM T7+ OCR
Surface impurity <1 E10 Atoms/cm²
 
200MM/300MM Premium Oxide Wafer
 
  200MM 300MM
Oxide thickness 500±25nm
Variation in oxide thickness
(for one wafer)
<3%
Variation in oxide thickness
(for multiple wafers)
<3%
SPEC 0.2μm≤30ea
Diameter(mm) 200±0.2mm 300±0.2mm
Type P
Crystal orientation <100>±1
Notch direction <100>±1
Resistance value (Ω ·cm) 1-100
Thickness(μm) 725±25
TTV(μm) ≤25 ≤10
BOW(μm) ≤40
WARP(μm) ≤40
Surface impurity ≤5.0 E10 Atom/cm² <1 E10 Atoms/cm²
 
* For additional film types, thicknesses, and compositions, please contact us.

At Fine Silicon Manufacturing (Shanghai) Ltd., we proudly offer the highest quality silicon wafers at competitive prices. As the most widely used semiconductor material, our WaferPro silicon wafers strike the perfect balance between cost and performance.

Whether you are in the market for silicon wafers for sale or need to purchase silicon wafers online, our extensive inventory includes SEMI standard silicon wafers in diameters of 2", 3", 100mm, 125mm, 150mm, 200mm, and 300mm, all ready for immediate shipping.

If you require custom wafer sizes or specifications beyond our standard offerings,please contact our expert team to fulfill your unique semiconductor wafer requirements, leveraging our extensive supply chain partnerships.

Certifications

Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Packaging & Shipping

Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Company Profile
 
Fine Silicon Manufacturing (Shanghai) Ltd., established in August 2008, stands as a beacon of excellence in the silicon wafer industry. Nestled in the dynamic Shanghai Pudong New Area, our state-of-the-art wafer reclaim factory specializes in the meticulous lapping and polishing of 6-12 inch wafers, boasting an impressive capacity of 50,000 pieces per month. Beyond this, we are proud to serve as agents for particle-controlled test wafers reclaim, wafer film coating, and wafer thinning. For those seeking unparalleled quality and precision, we invite you to CONTACT US for more information and discover the difference that sets us apart.
Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
 
 
Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
Our Advantages

Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth MethodSilicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Advanced CZ Growth Method
FAQ
 

Q: What's the way of shipping?
A: We proudly offer multiple shipping options to ensure your convenience. We accept DHL, FedEx, ***, UPS, EMS, SF, and more.
Q: How to pay?
A: We provide several payment methods for your ease. You can pay via T/T, PayPal,and other popular methods.
Q: What's the delivery time?
A: For inventory items, we guarantee an efficient delivery time of just 5 workdays.
For customized products, the delivery time ranges from 7 to 25 workdays, depending on the quantity and complexity of your order.
Q: Can I customize the products based on my needs?
A: Absolutely! We can tailor the material, specifications, and optical coating of your optical components to match your exact requirements.

Every customer's specification is unique, and FSM specializes in delivering wafers that meet your precise specifications.

If you do not see the specification you require, please
to speak with a member of our experienced and knowledgeable sales staff.

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