Japanese Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, High Precision

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a team of seasoned professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
• Wide Range of Products : From Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, our extensive selection meets all your specific requirements.
• Customization : We excel in producing custom wafers tailored to your exact specifications, ensuring the success of your project.
• Fast Turnaround : Thanks to our streamlined processes and well-stocked inventory, we ensure quick delivery to keep your projects on track.
• Global Reach : Shipping worldwide from our warehouses in China and Japan, we serve customers in over 50 countries.

Dummy wafers, also known as test wafers, are primarily used for experiments and testing, distinct from general product wafers.
As a result, reclaimed wafers are mostly utilized as dummy wafers for testing purposes.

Dummy wafers enhance safety in the initial stages of production and are crucial for delivery checks and process evaluations.
Given their experimental use, the size and thickness of dummy wafers are typically critical factors.

Wafers processed with film deposition are referred to as film wafers.
Examples of film growth include isolation films for inter-layer insulation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Reference Values for Usage

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM High-Quality Test Wafers

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Advanced Test Wafers

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Premium Oxide Wafers
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For further inquiries about different film types, thicknesses, and compositions, please contact us directly.

At Fine Silicon Manufacturing (Shanghai) Ltd., we offer top-tier silicon wafers at highly competitive prices. Silicon wafers are crucial to today's semiconductor technology. Our WaferPro silicon wafers provide the perfect balance of cost-effectiveness and high performance.

Whether you're in the market for silicon wafers or need to purchase them online, our extensive inventory includes SEMI standard silicon wafers in 2", 3", 100mm, 125mm, 150mm, 200mm, and 300mm diameters, all available for immediate shipping.

For custom sizes or specifications beyond our standard online offerings,to address your unique semiconductor wafer needs, leveraging our vast network of supply chain partnerships.

Certifications

Packaging & Shipping

Company Profile

 

Fine Silicon Manufacturing(Shanghai) Ltd., founded in August 2008, stands as a pillar of precision in the silicon wafer industry. Our state-of-the-art wafer reclaim factory, located in the bustling Shanghai Pudong New Area, specializes in the lapping and polishing of 6-12 inch wafers, boasting an impressive capacity of 50,000 pieces per month. As a dedicated innovator, we're also proud agents of particle-controlled test wafer reclaim, cutting-edge wafer film coating, and precise wafer thinning services. For those seeking excellence in silicon wafer solutions, your search ends here. Please CONTACT US for more detailed information and customized solutions.

 

 

Our Advantages

FAQ

 

Q: What are the available shipping methods?
A: We offer a variety of shipping options: DHL, FedEx, ***, UPS, EMS, SF, and more.
Q: What payment methods do you accept?
A: We accept T/T and PayPal as payment methods, among others.
Q: What is the delivery time?
A: For items in stock, the delivery time is typically 5 business days.
For custom orders, the delivery time ranges from 7 to 25 business days, depending on the quantity.
Q: Can the products be customized to my specifications?
A: Absolutely! We offer customization for materials, specifications, and optical coatings to suit your specific needs.

Each customer's requirements are unique, and FSM is equipped to supply wafers that meet your exact specifications.

If you don't find the specifications you need, please

to speak with a member of our knowledgeable and experienced sales team.