Superior Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Choices

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose Fine Silicon Manufacturing?

• Our Unparalleled Expertise : Backed by a team of seasoned professionals and equipped with cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
• Diverse Product Portfolio : From robust Czochralski (CZ) and precision Float Zone (FZ) silicon wafers to advanced SOI and glass wafers, our extensive selection caters to your unique specifications.
• Tailored Customization : We are experts in crafting custom wafers to your precise specifications, ensuring the triumph of your project.
• Swift Turnaround : Our efficient processes and ready-to-ship inventory allow us to offer rapid delivery, ensuring your projects remain on schedule.
• Global Presence : Shipping from our strategic warehouses in China and Japan, we serve clientele in over 50 countries globally.

Dummy wafers, often referred to as test wafers, are primarily used for experimental and testing purposes, distinguishing them from standard production wafers.
Consequently, reclaimed wafers are predominantly utilized as dummy wafers or test wafers.

In production environments, dummy wafers enhance safety at the outset of the production process and are vital for delivery checks and process evaluations.
Due to their experimental and testing nature, the size and thickness of dummy wafers are crucial considerations in many applications.

Wafers that undergo film deposition processes are termed as film wafers.
Film examples include isolation films for layer separation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Utilize Reference Values for Optimal Performance

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Precision Test Wafer

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

Cutting-Edge 300MM Test Wafer

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

Versatile 200MM/300MM Oxide Wafer
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For detailed inquiries on diverse film types, thicknesses, and compositions, please reach out to us.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing(Shanghai) Ltd., founded in the vibrant city of Shanghai in August 2008, stands as a beacon of innovation and excellence in the silicon industry. Our state-of-the-art wafer reclaim facility, strategically located in Shanghai's dynamic Pudong New Area, is dedicated to the sophisticated lapping and polishing of 6-12 inch wafers, boasting an impressive production capacity of 50,000 pieces each month. Beyond our core offerings, we proudly serve as a trusted agent for particle-controlled test wafer reclaim, wafer film coating, and wafer thinning services. Our commitment to quality and precision makes us your ideal partner in advancing silicon technology. If you are intrigued by our capabilities and wish to explore opportunities for collaboration, we warmly invite you to CONTACT US for comprehensive details and personalized service.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping methods you offer?
A: We offer a range of reliable shipping options, including DHL, FedEx, TNT, UPS, EMS, SF, and more.
Q: What are the accepted payment methods for transactions?
A: We accept secure payment through T/T and PayPal,and several other methods to suit your convenience.
Q: How long does delivery take for orders?
A: For in-stock items, expect delivery within a swift 5 working days.
For customized orders, delivery ranges from 7 to 25 working days, depending on your order's size and requirements.
Q: Can products be tailored to specific requirements?
A: Absolutely! We offer customization for materials, specifications, and optical coatings to perfectly suit your optical component needs.

We acknowledge that each customer's specifications are distinct, and FSM is committed to providing wafers that align with your precise demands.

If you can't find the specifications you need, please CONTACT FSMto connect with our experienced and knowledgeable sales team, ready to assist you.