12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Product Details
Customization: Available
Application: Semi Standard
Material: Compound Semiconductor
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  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
  • 12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
12inch
Growth Method
CZ
Crystal Orientation
100
Dopant
Boron
Resistivity
1-100Ω
Frront Side
Polished
Edge
Polished
Diameter
300±0.2mm
Thickness
775±25μm
Transport Package
Semi Standard
Specification
TBD
Trademark
FSM
Origin
China
HS Code
3818001920
Production Capacity
5000PCS/Month

Product Description

Product Description

Why Choose FSM?

  • Expertise: With a team of experienced professionals and state-of-the-art manufacturing facilities, we deliver consistently high-quality wafers.
  • Wide Range of Products: From Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, we offer a comprehensive selection to meet your specific needs.
  • Customization: We specialize in manufacturing custom wafers to your exact specifications, ensuring your project's success.
  • Fast Turnaround: Our streamlined processes and in-stock inventory enable us to provide quick delivery, keeping your projects on schedule.
  • Global Reach: We ship worldwide from our China and Japan warehouse, serving customers in over 50 countries.

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Dummy wafers (also called as test wafers) are wafers mainly used for experiment and test and being different from general wafers for product.
Accordingly, reclaimed wafers are mostly applied as dummy wafers (test wafers).

Dummy wafers are often used in a production device to improve safety in the beginning of production process and are used for delivery check and evaluation of process form.
As dummy wafers are often used for experiment and test, size and thickness thereof are important factors in most occasions.

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Wafers processed with film deposition is called film wafer.
Examples of film to be used (growth of film) include isolation film as isolation material between layers, metal film as conductive material, process material such as resist and protective film.

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Product Parameters


Use reference value
 

Item Specification
Diameter 150mm 200mm 300mm
Type P/N P/N P/N
Notch SEMI/JEIDA Notch/OF Notch
Thickness(μm) 675±25/625±25 725±25 725±25
Surface Polished Polished Polished
Inside Etched Etched Etched
Package CoinRoll CoinRoll CoinRoll



150MM/200MM Test wafer
 

150MM
SPEC 0.2um≤30ea
Diameter(mm) 150±0.2mm
Type P
Olyfra length 57.5mm±2.5mm 47.5mm±2.5mm
Resistance value ( Ω·cm ) 1-100
Thickness(μm) SEMI JEIDA
675um±25um 675um±25um
TTV(μm) ≤30um
BOW(μm) ≤40um
WARP(μm) ≤40um
Surface impurity ≤5.0E 10 atom/cm²


 
200MM
SPEC 0.2um≤30ea -
Diameter(mm) 200±0.2mm
Type P
Crystal orientation <110>±1
Notch direction
Resistance value ( Ω·cm ) 1-100
Thickness(μm) 725um±25um
TTV(μm) ≤25um ≤2um
BOW(μm) ≤40um
WARP(μm)
LM NO
Surface impurity ≤5.0E 10 atom/cm²


300MM Test wafer
 
300MM
SPEC 0.045um≤50ea 0.065um≤50ea 0.09um<50ea 0.12um<50ea
Manufacturing method CZ
Diameter(mm) 300±0.2mm
Type/Dopant P/Boron
Crystal orientation <100>±1
Notch direction
Resistance value (Ω·cm) 1-100
Thickness(μm) 775±25
TTV(μm) ≤10
BOW(μm) ≤40
WARP(μm)
LM T7+ OCR
Surface impurity <1 E10 Atoms/cm²



200MM/300MM Oxide wafer

 
  200MM 300MM
Oxide thickness 500±25nm
Variation in oxide thickness
(for one wafer)
<3%
Variation in oxide thickness
(for multiple wafers)
<3%
SPEC 0.2μm≤30ea
Diameter(mm) 200±0.2mm 300±0.2mm
Type P
Crystal orientation <100>±1
Notch direction <100>±1
Resistance value (Ω ·cm) 1-100
Thickness(μm) 725±25
TTV(μm) ≤25 ≤10
BOW(μm) ≤40
WARP(μm) ≤40
Surface impurity ≤5.0 E10 Atom/cm² <1 E10 Atoms/cm²


* Please contact us for other film types, film thickness, and film composition.


 

Certifications

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Packaging & Shipping

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Company Profile

Fine Silicon Manufacturing(Shanghai) Ltd. was established in August, 2008. We built a wafer reclaim factory in Shanghai Pudong New Area,  providing mainly 6-12inch wafers lapping and polishing. 50K PCS/month capacity. Meanwhile, we are the agent of particle controlled test wafers reclaim, wafer film coating, wafer thinning. If you have interest, PleaseCONTACT USfor more information.
12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer


12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

Our Advantages

12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer12inch 300mm Dummy Semiconductors Polished Oxide Silicon Wafer

FAQ

Q: What's the way of shipping ?
A:  We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q: How to pay?
A:  T/T, PayPal and etc..
Q: What's the deliver time?
A:  For inventory: the delivery time is 5 workdays.
      For customized products: the delivery time is 7 to 25 workdays. According to the quantity.
Q: Can I customize the products based on my need?
A:  Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.

Every customer's specification is unique and FSM can supply wafers that meet your exact specifications.

If you do not see the specification you require, please CONTACT FSM to speak with a member of our experienced and knowledgeable sales staff.

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