Premium Quality Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a powerhouse team of seasoned experts and cutting-edge manufacturing facilities, we consistently deliver wafers that exemplify the pinnacle of quality.
• Wide Range of Products : Discover our extensive array of offerings, from Czochralski (CZ) and Float Zone (FZ) silicon wafers to innovative SOI and glass wafers, ensuring all your specific requirements are met.
• Customization : Our forte lies in crafting tailored wafers to your precise specifications, guaranteeing the triumph of your projects with unmatched precision.
• Fast Turnaround : Thanks to our streamlined processes and ample inventory, we promise rapid delivery, keeping your projects seamlessly on track.
• Global Reach : Our expansive network from our hubs in China and Japan allows us to ship worldwide, proudly serving clients in over 50 countries.

Dummy wafers, also known as test wafers, are specialized wafers primarily used for experiments and testing, distinct from typical product wafers.
Reclaimed wafers find their niche predominantly as dummy wafers (test wafers), perfectly suited for experimental applications.

In production devices, dummy wafers are instrumental in enhancing safety at the onset of production processes and are pivotal for delivery checks and process evaluation.
Given their frequent use in experiments and testing, the size and thickness of dummy wafers are crucial factors in many scenarios.

Wafers that undergo film deposition are termed as film wafers.
Film growth examples include isolation films for interlayer insulation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Use reference value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer: Our high-performance test wafers in 150MM and 200MM sizes are designed to meet the rigorous demands of various semiconductor testing processes, ensuring precision and reliability.

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer: Discover superior testing with our cutting-edge 300MM test wafers, engineered for optimal performance in advanced semiconductor manufacturing applications.

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer: Experience ultimate quality with our 200MM and 300MM oxide wafers, crafted to deliver excellent results in your semiconductor processes.
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for additional film types, customized film thickness options, and specific film compositions tailored to your unique needs. Our team is ready to assist you in achieving your project goals.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

 

 

 

Our Advantages

 

FAQ

 

Q: What's the way of shipping?
A: We offer a variety of trusted shipping options, including DHL, FedEx, TNT, UPS, EMS, and SF, to ensure your products arrive safely and on time.
Q: How to pay?
A: We provide convenient payment methods such as T/T and PayPal, among others to suit your preferences.
Q: What's the delivery time?
A: For items in inventory, expect speedy delivery within 5 working days.
For customized products, the time frame is between 7 to 25 working days, depending on the quantity and specifications.
Q: Can I customize the products based on my need?
A: Absolutely! We specialize in tailoring materials, specifications, and optical coatings for your optical components to fit your specific requirements.

Every customer's specification is unique, and at Fine Silicon Manufacturing (Shanghai) Ltd., we deliver wafers that meet your exact specifications.

If you do not see the specification you require, pleaseCONTACT FSMto discuss your needs with our experienced and knowledgeable sales team.