Customization: | Available |
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Application: | Semi Standard |
Material: | Compound Semiconductor |
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Item | Specification | ||
Diameter | 150mm | 200mm | 300mm |
Type | P/N | P/N | P/N |
Notch | SEMI/JEIDA | Notch/OF | Notch |
Thickness(μm) | 675±25/625±25 | 725±25 | 725±25 |
Surface | Polished | Polished | Polished |
Inside | Etched | Etched | Etched |
Package | CoinRoll | CoinRoll | CoinRoll |
150MM/200MM Test Wafer: Specifically engineered for precision and reliability, our 150MM and 200MM test wafers are perfect for a wide range of applications, ensuring you achieve exceptional outcomes in your semiconductor processes.
150MM | ||
SPEC | 0.2um≤30ea | |
Diameter(mm) | 150±0.2mm | |
Type | P | |
Olyfra length | 57.5mm±2.5mm | 47.5mm±2.5mm |
Resistance value ( Ω·cm ) | 1-100 | |
Thickness(μm) | SEMI | JEIDA |
675um±25um | 675um±25um | |
TTV(μm) | ≤30um | |
BOW(μm) | ≤40um | |
WARP(μm) | ≤40um | |
Surface impurity | ≤5.0E 10 atom/cm² |
200MM | ||
SPEC | 0.2um≤30ea | - |
Diameter(mm) | 200±0.2mm | |
Type | P | |
Crystal orientation | <110>±1 | |
Notch direction | ||
Resistance value ( Ω·cm ) | 1-100 | |
Thickness(μm) | 725um±25um | |
TTV(μm) | ≤25um | ≤2um |
BOW(μm) | ≤40um | |
WARP(μm) | ||
LM | NO | |
Surface impurity | ≤5.0E 10 atom/cm² |
300MM | ||||
SPEC | 0.045um≤50ea | 0.065um≤50ea | 0.09um<50ea | 0.12um<50ea |
Manufacturing method | CZ | |||
Diameter(mm) | 300±0.2mm | |||
Type/Dopant | P/Boron | |||
Crystal orientation | <100>±1 | |||
Notch direction | ||||
Resistance value (Ω·cm) | 1-100 | |||
Thickness(μm) | 775±25 | |||
TTV(μm) | ≤10 | |||
BOW(μm) | ≤40 | |||
WARP(μm) | ||||
LM | T7+ OCR | |||
Surface impurity | <1 E10 Atoms/cm² |
200MM | 300MM | |
Oxide thickness | 500±25nm | |
Variation in oxide thickness (for one wafer) |
<3% | |
Variation in oxide thickness (for multiple wafers) |
<3% | |
SPEC | 0.2μm≤30ea | |
Diameter(mm) | 200±0.2mm | 300±0.2mm |
Type | P | |
Crystal orientation | <100>±1 | |
Notch direction | <100>±1 | |
Resistance value (Ω ·cm) | 1-100 | |
Thickness(μm) | 725±25 | |
TTV(μm) | ≤25 | ≤10 |
BOW(μm) | ≤40 | |
WARP(μm) | ≤40 | |
Surface impurity | ≤5.0 E10 Atom/cm² | <1 E10 Atoms/cm² |
Q: What's the way of shipping?
A: At Fine Silicon Manufacturing (Shanghai) Ltd., we provide a variety of shipping options including DHL, FedEx, TNT, UPS, EMS, and SF, among others to ensure smooth and timely delivery.
Q: How to pay?
A: We offer convenient payment methods including T/T and PayPal, among others, to facilitate seamless transactions.
Q: What's the delivery time?
A: For items in stock, you can expect delivery within just 5 workdays.
For customized products, the delivery time ranges from 7 to 25 workdays, depending on the quantity and your specific requirements.
Q: Can I customize the products based on my need?
A: Absolutely! We specialize in customizing material, specifications, and optical coatings for your optical components, tailored precisely to meet your unique needs.
Every customer's specification is uniquely valued, and FSM is dedicated to providing wafers that meet your exact specifications.