Innovative Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Features

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a distinguished team of seasoned professionals and cutting-edge manufacturing facilities, Fine Silicon Manufacturing (Shanghai) Ltd. consistently delivers wafers of the highest caliber.
• Wide Range of Products : From the precision-engineered Czochralski (CZ) and Float Zone (FZ) silicon wafers to advanced SOI and glass wafers, we offer a diverse array of products tailored to meet your precise requirements.
• Customization : We excel in producing bespoke wafers designed to your exacting specifications, ensuring the triumph of your unique projects.
• Fast Turnaround : Our efficient processes, coupled with a robust in-stock inventory, empower us to deliver products swiftly, ensuring your projects remain on track and within timelines.
• Global Reach : Strategically shipping worldwide from our well-positioned warehouses in China and Japan, we proudly serve a diverse clientele across more than 50 countries.

Dummy wafers, also known as test wafers, are primarily utilized for experimental and testing purposes, distinct from conventional product wafers.
Reclaimed wafers are typically employed as dummy wafers (test wafers), maximizing their utility in experimental settings.

Dummy wafers enhance safety during the initial stages of production. They are indispensable for delivery checks and process form evaluations.
Due to their critical role in experiments and tests, the size and thickness of dummy wafers are vital considerations in most scenarios.

Wafers treated with film deposition are referred to as film wafers.
Film types used include isolation films for interlayer separation, metal films as conductive pathways, and process materials like resist and protective films.

Product Parameters

 

Use reference value for optimal performance and reliability.

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

Expertly crafted 150MM/200MM Test Wafer, designed to meet high industry standards.

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

Precision-engineered 300MM Test Wafer for advanced testing requirements.

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

Top-quality 200MM/300MM Oxide Wafer, ideal for sophisticated applications.
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for a variety of film types, specific film thicknesses, and customized film compositions tailored to your needs.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing(Shanghai) Ltd., an esteemed name in the industry, was founded in August 2008. Nestled in the vibrant Shanghai Pudong New Area, we have constructed a state-of-the-art wafer reclaim facility. This facility specializes in lapping and polishing a wide range of wafers, from 6 to 12 inches, boasting a substantial capacity of 50,000 pieces per month. Furthermore, we proudly serve as an agent in the domains of particle-controlled test wafer reclaiming, advanced wafer film coating, and precision wafer thinning. If you are intrigued by our offerings and seek further details, please do not hesitate to CONTACT US for more information.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping methods?
A: We provide a range of shipping options including DHL, FedEx, TNT, UPS, EMS, and SF Express, ensuring you receive your order through a reliable service of your choice.
Q: Which payment methods do you accept?
A: We offer multiple payment options such as T/T and PayPal, providing the flexibility to choose the one that suits you best.
Q: How long does delivery take?
A: For items we have in stock, expect a swift delivery within 5 business days.
For customized orders, the delivery timeline is 7 to 25 business days, adapting to the quantity and complexity of your request.
Q: Is product customization available to fit my specific requirements?
A: Absolutely! We specialize in tailoring materials, specifications, and optical coatings to match your exact needs for optical components.

Each customer's requirements are distinct, and Fine Silicon Manufacturing (Shanghai) Ltd. is committed to delivering wafers precisely crafted to your detailed specifications.

Should you require a specification not listed, pleaseCONTACT FSMto connect with a member of our dedicated and expert sales team, ready to assist you.