Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer, Japanese Quality, Boron Doped

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a team of seasoned experts and cutting-edge manufacturing facilities, we consistently deliver wafers of unparalleled quality.
• Wide Range of Products : From Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, our extensive selection is designed to fulfill all your specific requirements.
• Customization : We excel in producing custom wafers precisely to your specifications, ensuring the success of your projects.
• Fast Turnaround : Thanks to our streamlined operations and readily available inventory, we provide swift delivery to keep your projects on track.
• Global Reach : With warehouses in China and Japan, we serve over 50 countries worldwide.

Dummy wafers, also known as test wafers, are specially designed for experiments and testing, distinct from standard production wafers.
Reclaimed wafers are frequently utilized as dummy (test) wafers.

Dummy wafers are crucial for initial safety checks in production devices and are used for delivery checks and process evaluations.
Given their experimental and testing roles, the size and thickness of dummy wafers are critical in most scenarios.

Wafers that undergo film deposition are referred to as film wafers.
Examples of film applications include isolation films for layer separation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Use Reference Value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for information on other film types, film thicknesses, and film compositions.

At Fine Silicon Manufacturing (Shanghai) Ltd., we pride ourselves on offering the highest quality silicon wafers at competitive prices. As the most commonly used semiconductor material today, our silicon wafers strike the perfect balance between cost and performance.

Whether you're looking to purchase silicon wafers in person or online, our comprehensive inventory includes SEMI standard silicon wafers in diameters of 2", 3", 100mm, 125mm, 150mm, 200mm, and 300mm, all available for immediate shipping.

For custom wafer sizes or specifications beyond our standard online offerings, to meet your unique semiconductor wafer requirements. Leverage our extensive supply chain partnerships for unparalleled service and support.

Certifications

Packaging & Shipping

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd., established in August 2008, is your premier partner in the heart of Shanghai Pudong New Area. Our state-of-the-art wafer reclaim factory specializes in providing top-notch lapping and polishing services for wafers ranging from 6 to 12 inches, with an impressive capacity of 50K pieces per month. In addition, we proudly represent particle-controlled test wafers reclaim, wafer film coating, and wafer thinning solutions. For more information and to explore how we can cater to your specific needs, please CONTACT US today.

 

 

Our Advantages

FAQ

 

Q: What's the way of shipping?
A: We offer a variety of reliable shipping options, including DHL, FedEx, ***, UPS, EMS, and SF, among others.
Q: How to pay?
A: We accept multiple payment methods including T/T and PayPal.Additionally, other payment options may be available upon request.
Q: What's the delivery time?
A: For inventory items, the delivery time is typically within 5 business days.
For customized products, the delivery time ranges from 7 to 25 business days, depending on the quantity and specific requirements.
Q: Can I customize the products based on my need?
A: Absolutely! We can tailor the material, specifications, and optical coatings of our products to meet your precise needs.

Each customer's specification is unique, and Fine Silicon Manufacturing (Shanghai) Ltd. can supply wafers that meet your exact requirements.

If the specification you require is not listed, please

to speak with a member of our experienced and knowledgeable sales staff.