Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer

Product Details
Customization: Available
Application: Semi Standard
Growth Method: CZ
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  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
  • Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
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  • Overview
  • Product Description
  • Product Parameters
  • Certifications
  • Packaging & Shipping
  • Company Profile
  • Our Advantages
  • FAQ
Overview

Basic Info.

Model NO.
12inch
Edge
Polished
Diameter
300±0.2mm
Thickness
775±25μm
Transport Package
Semi Standard
Specification
TBD
Trademark
FSM
Origin
China
HS Code
3818001920
Production Capacity
5000PCS/Month

Product Description

Product Description
 

Why Choose FSM?

  • Expertise : With a team of seasoned professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
  • Wide Range of Products : From Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, our extensive selection is designed to meet your precise needs.
  • Customization : We excel in crafting custom wafers tailored to your exact specifications, ensuring the success of your projects.
  • Fast Turnaround : Thanks to our streamlined processes and readily available inventory, we provide rapid delivery to keep your projects on track.
  • Global Reach : With warehouses in China and Japan, we serve customers in over 50 countries, shipping our products worldwide.
Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Dummy wafers (also known as test wafers) are primarily used for experiments and tests, differing from standard production wafers.
Reclaimed wafers are predominantly used as dummy wafers (test wafers).

Dummy wafers are frequently employed in production devices to enhance safety at the start of the production process and are used for delivery checks and process evaluations.
Given their frequent use in experiments and tests, the size and thickness of dummy wafers are critical factors.
Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon WaferDummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Wafers processed with film deposition are referred to as film wafers.
Examples of films used include isolation films for layer separation, metal films as conductive materials, and various process materials such as resist and protective films.
Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon WaferDummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Product Parameters
 

Reference Values for Optimal Use

Item Specification
Diameter 150mm 200mm 300mm
Type P/N P/N P/N
Notch SEMI/JEIDA Notch/OF Notch
Thickness(μm) 675±25/625±25 725±25 725±25
Surface Polished Polished Polished
Inside Etched Etched Etched
Package CoinRoll CoinRoll CoinRoll
 

Precision-Crafted 150MM/200MM Test Wafers

150MM
SPEC 0.2um≤30ea
Diameter(mm) 150±0.2mm
Type P
Olyfra length 57.5mm±2.5mm 47.5mm±2.5mm
Resistance value ( Ω·cm ) 1-100
Thickness(μm) SEMI JEIDA
675um±25um 675um±25um
TTV(μm) ≤30um
BOW(μm) ≤40um
WARP(μm) ≤40um
Surface impurity ≤5.0E 10 atom/cm²
 
200MM
SPEC 0.2um≤30ea -
Diameter(mm) 200±0.2mm
Type P
Crystal orientation <110>±1
Notch direction
Resistance value ( Ω·cm ) 1-100
Thickness(μm) 725um±25um
TTV(μm) ≤25um ≤2um
BOW(μm) ≤40um
WARP(μm)
LM NO
Surface impurity ≤5.0E 10 atom/cm²
 
High-Quality 300MM Test Wafers
300MM
SPEC 0.045um≤50ea 0.065um≤50ea 0.09um<50ea 0.12um<50ea
Manufacturing method CZ
Diameter(mm) 300±0.2mm
Type/Dopant P/Boron
Crystal orientation <100>±1
Notch direction
Resistance value (Ω·cm) 1-100
Thickness(μm) 775±25
TTV(μm) ≤10
BOW(μm) ≤40
WARP(μm)
LM T7+ OCR
Surface impurity <1 E10 Atoms/cm²
 
Premium 200MM/300MM Oxide Wafers
 
  200MM 300MM
Oxide thickness 500±25nm
Variation in oxide thickness
(for one wafer)
<3%
Variation in oxide thickness
(for multiple wafers)
<3%
SPEC 0.2μm≤30ea
Diameter(mm) 200±0.2mm 300±0.2mm
Type P
Crystal orientation <100>±1
Notch direction <100>±1
Resistance value (Ω ·cm) 1-100
Thickness(μm) 725±25
TTV(μm) ≤25 ≤10
BOW(μm) ≤40
WARP(μm) ≤40
Surface impurity ≤5.0 E10 Atom/cm² <1 E10 Atoms/cm²
 
* For detailed information on other film types, thicknesses, and compositions, please contact us.

At Fine Silicon Manufacturing (Shanghai) Ltd., we offer the highest quality silicon wafers at competitive prices. Our silicon wafers are the cornerstone of modern semiconductor technology, providing an optimal balance of cost-effectiveness and performance.

Whether you seek silicon wafers for immediate purchase or need to buy online, our vast in-stock inventory includes SEMI standard silicon wafers available in diameters of 2", 3", 100mm, 125mm, 150mm, 200mm, and 300mm, all ready for swift shipping.

For custom wafer sizes or unique specifications beyond our standard online offerings,reach out to our dedicated teamto leverage our extensive supply chain partnerships and meet your specific semiconductor wafer requirements.

Certifications

Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Packaging & Shipping

Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Company Profile
 
Fine Silicon Manufacturing (Shanghai) Ltd., founded in August 2008, stands as a beacon of innovation and excellence in the silicon wafer industry. Proudly rooted in the Shanghai Pudong New Area, our state-of-the-art wafer reclaim factory specializes in the meticulous lapping and polishing of 6-12 inch wafers, boasting an impressive capacity of 50,000 PCS per month. In addition to our core services, we serve as esteemed agents for particle-controlled test wafers reclaim, advanced wafer film coating, and precise wafer thinning techniques. If you are intrigued by our offerings and seek further details, please CONTACT US for more information.
Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
 
 
Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
Our Advantages

Dummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon WaferDummy Wafer, Test Wafer, Oxide Wafer, Boron Doped, Crystal Orientation Silicon Wafer
FAQ
 

Q: What are the available shipping methods?
A: We offer multiple shipping options including DHL, FedEx, ***, UPS, EMS, SF, and more.
Q: What payment methods do you accept?
A: We accept T/T, PayPaland more.
Q: What is the delivery time?
A: For in-stock items, the delivery time is 5 business days.
For customized products, delivery time ranges from 7 to 25 business days, depending on the order quantity.
Q: Can I customize products based on my specific needs?
A: Absolutely! We can tailor the material, specifications, and optical coatings of your optical components to meet your unique requirements.

Each customer's specifications are unique, and Fine Silicon Manufacturing (Shanghai) Ltd. can supply wafers that meet your exact needs.

If you do not see the specifications you require, please
to speak with a member of our experienced and knowledgeable sales team.

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