High Quality Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a dedicated team of highly experienced professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of unparalleled quality.
• Wide Range of Products : Our diverse selection, from Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, ensures that we can meet your specific and unique requirements.
• Customization : We excel in crafting custom wafers tailored precisely to your specifications, guaranteeing the success of your project.
• Fast Turnaround : Thanks to our efficient processes and extensive in-stock inventory, we offer rapid delivery to keep your projects on track.
• Global Reach : With an expansive distribution network, we ship worldwide from our China and Japan warehouses, proudly serving customers in over 50 countries.

Dummy wafers, also known as test wafers, are primarily utilized for experimentation and testing, setting them apart from standard production wafers.
Reclaimed wafers are predominantly employed as dummy wafers, commonly referred to as test wafers, showcasing their versatility in testing applications.

Dummy wafers are strategically used in production devices to enhance safety at the initial stages of production, while also being employed for delivery checks and process evaluation.
Given their frequent use in experiments and tests, the size and thickness of dummy wafers are critical factors in determining their effectiveness.

Wafers processed with film deposition are termed film wafers.
Film wafers involve the application of various films, such as isolation films between layers, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Utilize Reference Value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer - Precision at its Best

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer - Engineered for Excellence

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer - Superior Performance Assured
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For customized film types, thickness, and composition, please contact us to discuss tailored solutions that meet your specific needs.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Founded in the vibrant city of Shanghai in August 2008, Fine Silicon Manufacturing (Shanghai) Ltd. stands as a beacon of innovation and excellence in the silicon wafer industry. Our state-of-the-art wafer reclaim factory, nestled in the dynamic Pudong New Area, specializes in the meticulous lapping and polishing of 6-12 inch wafers, boasting an impressive production capacity of 50,000 pieces per month. As a versatile enterprise, we also proudly serve as agents for particle-controlled test wafer reclamation, advanced wafer film coating, and precision wafer thinning. For those eager to explore collaboration or learn more about our cutting-edge services, we invite you to CONTACT US for further information and partnership opportunities.

 

 

Our Advantages

 

FAQ

 

Q: What's the way of shipping?
A: We offer a variety of shipping options to suit your needs, including leading carriers such as DHL, Fedex, TNT, UPS, EMS, and SF, among others.
Q: How to pay?
A: We provide flexible payment options like T/T and PayPal, along with other convenient methods.
Q: What's the delivery time?
A: For items in stock, expect a swift delivery time of just 5 business days.
For customized products, our delivery ranges from 7 to 25 working days, depending on your order quantity.
Q: Can I customize the products based on my needs?
A: Absolutely! We specialize in tailoring the material, specifications, and optical coatings of your optical components to fit your precise requirements.

Each customer's specification is distinct, and Fine Silicon Manufacturing (Shanghai) Ltd. is committed to providing wafers that align perfectly with your exact needs.

If you don't find the specifications you need listed, please CONTACT FSMto consult with our seasoned and insightful sales team ready to assist you.