Enhanced Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Options

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : Our distinguished team of skilled professionals and cutting-edge manufacturing facilities empower us to deliver wafers of unparalleled quality time and time again.
• Wide Range of Products : Explore our extensive portfolio, from Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, all designed to perfectly align with your unique requirements.
• Customization : We excel in crafting bespoke wafers tailored meticulously to your precise specifications, paving the way for your project's triumph.
• Fast Turnaround : Our efficient processes and abundant stock allow us to offer swift delivery, ensuring your projects remain right on track.
• Global Reach : With our expansive global footprint, we dispatch our products from China and Japan warehouses to delighted customers in over 50 countries.

Dummy wafers, also known as test wafers, are specialized wafers primarily utilized for experimentation and testing, distinguishing them from conventional production wafers.
Reclaimed wafers find their prime application as dummy wafers (test wafers), serving the industry's experimental needs.

Dummy wafers play a crucial role in production devices; they enhance safety at the inception of production, facilitate delivery checks, and aid in process evaluation.
Given their role in experiments and testing, the size and thickness of dummy wafers are critical considerations in many applications.

Wafers integrated with film deposition are referred to as film wafers.
Film wafers may include varieties like isolation films for layer separation, metal films for conductivity, and process materials such as resist and protective films.

Product Parameters

 

Use Reference Value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for additional film types, customized film thickness, and specific film compositions to meet your precise requirements.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Founded in the bustling hub of innovation, Fine Silicon Manufacturing (Shanghai) Ltd. has been a pioneer since its inception in August 2008. Our state-of-the-art wafer reclaim factory, strategically located in the vibrant Shanghai Pudong New Area, specializes in the meticulous lapping and polishing of 6-12 inch wafers. With a robust production capability of 50,000 pieces per month, we stand at the forefront of quality and efficiency. Additionally, we proudly serve as the trusted agent for particle-controlled test wafers reclaim, wafer film coating, and precision wafer thinning services. Intrigued by what we offer? Please don't hesitate to CONTACT US for more detailed information that could be crucial for your needs.

 

 

Our Advantages

 

FAQ

 

Q: What's the way of shipping ?
A: We offer a wide array of shipping options to cater to your needs, including DHL, FedEx, TNT, UPS, EMS, SF, and more.
Q: How to pay?
A: We provide flexible payment options including T/T and PayPal.and more.
Q: What's the delivery time?
A: For items in stock: Expect a swift delivery time of just 5 working days.
For customized products: Delivery spans 7 to 25 working days, depending on order quantity.
Q: Can I customize the products based on my need?
A: Absolutely! We offer customization for material, specifications, and optical coating tailored to your requirements.

Every customer's specification is unique, and FSM is adept at supplying wafers that align perfectly with your exact specifications.

If you don't see the specification you need, please CONTACT FSMto engage with a team member from our experienced and knowledgeable sales staff.