Top Grade Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer Offer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : Our team of seasoned professionals, coupled with cutting-edge manufacturing facilities, ensures that we consistently deliver wafers of the highest quality.
• Wide Range of Products : We offer an extensive variety of wafers, ranging from Czochralski (CZ) and Float Zone (FZ) silicon wafers to SOI and glass wafers, providing a comprehensive selection tailored to meet your unique requirements.
• Customization : We excel in crafting custom wafers that adhere to your precise specifications, guaranteeing the success of your project.
• Fast Turnaround : Thanks to our efficient processes and readily available inventory, we are equipped to offer expedited delivery, ensuring your projects remain on track.
• Global Reach : With warehouses in China and Japan, we efficiently ship worldwide, proudly serving clients in over 50 countries.

Dummy wafers, also known as test wafers, are primarily employed for experimentation and testing, distinguishing them from standard wafers used in products.
Reclaimed wafers are frequently utilized as dummy wafers (test wafers).

In production devices, dummy wafers are used to enhance safety at the start of the production process, and for delivery checks and process form evaluations.
As dummy wafers are primarily used for experimentation and testing, their size and thickness are critical factors in most scenarios.

Wafers that undergo film deposition are referred to as film wafers.
Film examples include isolation films, which serve as isolation materials between layers, metal films for conductivity, and process materials such as resist and protective films.

Product Parameters

 

Use Reference Value - Achieve Optimal Performance

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer - Precision Engineering for Reliable Results

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer - Advanced Technology for Superior Performance

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer - Quality Solutions for Diverse Applications
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Reach out to us for tailored solutions on various film types, thickness, and compositions.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd. was founded in August 2008, marking the beginning of a journey dedicated to excellence in silicon wafer solutions. Nestled in the vibrant heart of Shanghai's Pudong New Area, our state-of-the-art wafer reclaim facility stands poised to meet the demands of the ever-evolving semiconductor industry. Specializing in the lapping and polishing of 6-12 inch wafers, we boast an impressive capacity of 50,000 pieces per month. Our expertise doesn't stop there; we proudly serve as agents for reclaiming particle-controlled test wafers, as well as offering specialized services in wafer film coating and wafer thinning. If you are seeking unparalleled quality and precision in wafer processing, do not hesitate to CONTACT US for more detailed information.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping methods?
A: We are pleased to offer an array of shipping options including DHL, Fedex, TNT, UPS, EMS, SF, and more, tailored for your convenience.
Q: What payment methods do you accept?
A: We accept T/T and PayPal among others.
Q: What is the estimated delivery time for orders?
A: For items in stock, your order will be dispatched within 5 working days.
For custom-made products, delivery times range from 7 to 25 working days, contingent upon the order quantity.
Q: Is product customization available?
A: Absolutely. We provide bespoke customization for materials, specifications, and optical coatings based on your precise requirements.

Every customer's needs are distinct, and Fine Silicon Manufacturing can deliver wafers that match your exacting specifications.

If the specification you need isn't listed, please CONTACT FSMto connect with our expert and highly knowledgeable sales team, ready to assist you.