High Performance Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With our team of seasoned professionals and cutting-edge manufacturing facilities, Fine Silicon Manufacturing (Shanghai) Ltd. guarantees the delivery of consistently superior quality wafers, standing at the pinnacle of industry excellence.
• Wide Range of Products : From the renowned Czochralski (CZ) and Float Zone (FZ) silicon wafers to the versatile SOI and glass wafers, we present an extensive portfolio designed to satisfy your distinct requirements.
• Customization : Our specialization lies in crafting tailor-made wafers precisely per your specifications, ensuring the seamless success of your projects.
• Fast Turnaround : With streamlined processes and a well-stocked inventory, we ensure rapid delivery, keeping your projects on track and within schedule.
• Global Reach : With a robust global distribution network from our warehouses in China and Japan, we efficiently serve a vast clientele across more than 50 countries, ensuring worldwide customer satisfaction.

Dummy wafers, also known as test wafers, are primarily designed for experimental and testing purposes, distinguishing them from conventional production wafers.
As such, reclaimed wafers are predominantly utilized as dummy wafers (test wafers).

Dummy wafers are extensively used in production devices to enhance safety at the initial production stages and are vital for delivery checks and process form evaluations.
Given their frequent use in experiments and testing, the size and thickness of dummy wafers are critical factors in most circumstances.

Wafers processed with film deposition are referred to as film wafers.
Examples of films used (film growth) include isolation films for layer separation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Reference Values for Optimal Usage

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer - Exceptional Quality for Precision Testing

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer - Advanced Solutions for Accurate Results

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer - Superior Performance for Your Needs
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for additional film types, thickness variations, and specific film compositions tailored to your requirements.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd., a prestigious name in the semiconductor industry, was founded in August 2008. Our state-of-the-art wafer reclaim factory, nestled in the heart of Shanghai Pudong New Area, specializes in the meticulous lapping and polishing of 6-12 inch wafers, boasting an impressive capacity of 50,000 pieces per month. In addition to our flagship offerings, we proudly serve as the premier agent for particle-controlled test wafer reclaim, advanced wafer film coating, and precision wafer thinning services. If you are intrigued by our cutting-edge solutions, we warmly invite you to CONTACT US for further details.

 

 

Our Advantages

 

FAQ

 

Q: What are the available shipping options?
A: We offer a variety of shipping methods including DHL, FedEx, TNT, UPS, EMS, SF, and more for your convenience.
Q: What payment methods do you accept?
A: We accept T/T and PayPal, among other options.
Q: What is the delivery timeframe?
A: For in-stock items, our delivery time is typically 5 working days.
For custom-made products, the delivery period ranges from 7 to 25 working days, depending on the quantity required.
Q: Is it possible to customize products to suit my requirements?
A: Absolutely! We offer customization for material, specifications, and optical coating to perfectly match your optical component needs.

At FSM, we understand that every customer has unique specifications, and we are equipped to provide wafers tailored to meet your exact requirements.

If the specifications you need aren't listed, pleaseCONTACT FSMto connect with our highly skilled and knowledgeable sales team.