Silicon Wafer Machine 12inch N Type Dummy Wafer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Type: P-Type Semiconductor
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With a team of seasoned professionals and cutting-edge manufacturing facilities, we consistently deliver wafers of the highest quality.
• Wide Range of Products : Whether you require Czochralski (CZ) and Float Zone (FZ) silicon wafers or SOI and glass wafers, our extensive product lineup is designed to cater to your every need.
• Customization : Our specialty lies in crafting custom wafers tailored precisely to your specifications, ensuring the seamless success of your project.
• Fast Turnaround : Thanks to our streamlined processes and well-stocked inventory, we guarantee swift delivery to keep your projects on track.
• Global Reach : Delivering worldwide from our strategic hubs in China and Japan, we proudly serve a diverse clientele in over 50 countries.

Dummy wafers, also known as test wafers, are primarily utilized for experimental and testing purposes, differing from standard wafers used in products.
Reclaimed wafers are predominantly employed as dummy wafers (test wafers).

Dummy wafers are frequently utilized in production devices to enhance safety at the outset of the production process and are critical for delivery checks and process evaluation.
Given their role in experimentation and testing, the size and thickness of dummy wafers are crucial factors in most scenarios.

Wafers that undergo film deposition are referred to as film wafers.
Examples of films used include isolation films for inter-layer separation, metal films for conductivity, and process materials like resist and protective films.

Product Parameters

 

Use Reference Value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer - Perfect for innovative testing applications.

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer - Ideal for comprehensive testing needs in advanced research.

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer - Suitable for cutting-edge oxide applications.
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* For any additional film types, film thickness, or composition inquiries, please feel free to contact us. Our expert team is here to assist you with tailored solutions.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Since its inception in August 2008, Fine Silicon Manufacturing (Shanghai) Ltd. has carved a niche in the wafer reclaim industry. Strategically located in the bustling heart of Shanghai's Pudong New Area, our state-of-the-art facility specializes in the meticulous lapping and polishing of 6-12 inch silicon wafers. Boasting an impressive production capacity of 50,000 pieces per month, we stand at the forefront of innovation and efficiency. As a trusted agent, we also offer expert services in particle-controlled test wafer reclaim, advanced wafer film coating, and precision wafer thinning techniques. For those seeking unparalleled quality and service, we invite you to CONTACT US for comprehensive information and tailored solutions.

 

 

Our Advantages

 

FAQ

 

Q: What shipping methods are available?
A: We proudly offer a variety of shipping options, including DHL, FedEx, TNT, UPS, EMS, SF, and more.
Q: What are the accepted payment methods?
A: We accept T/T and PayPal as payment methods, along with other options as needed.
Q: How long is the delivery time?
A: For products in stock, expect a swift delivery time of just 5 business days.
For customized orders, delivery is typically within 7 to 25 business days, depending on the quantity required.
Q: Is product customization available to suit my needs?
A: Absolutely! We can tailor the material, specifications, and optical coating of your optical components to meet your specific requirements.

Each customer has unique specifications, and Fine Silicon Manufacturing (Shanghai) Ltd. is dedicated to providing wafers that match your precise needs.

If your desired specification is not listed, please CONTACT FSM to connect with our experienced and knowledgeable sales team for personalized assistance.