High Purity Silicon Wafer, Dummy Wafer, Test Wafer, Oxide Wafer

• Customization: Available
• Application: Semi Standard
• Material: Compound Semiconductor
• Model NO.: 12inch
• Growth Method: CZ
• Crystal Orientation: 100
• Dopant: Boron
• Resistivity: 1-100Ω
• Frront Side: Polished
• Edge: Polished
• Diameter: 300±0.2mm
• Thickness: 775±25μm
• Transport Package: Semi Standard
• Specification: TBD
• Trademark: FSM
• Origin: China
• HS Code: 3818001920
• Production Capacity: 5000PCS/Month

Product Description

Product Description

 

Why Choose FSM?

• Expertise : With our team of seasoned experts and cutting-edge manufacturing facilities, Fine Silicon Manufacturing delivers top-tier wafers that exemplify reliability and excellence.
• Wide Range of Products : Explore our expansive inventory, featuring Czochralski (CZ), Float Zone (FZ) silicon wafers, SOI, and specialized glass wafers, all designed to cater to your unique demands.
• Customization : We excel in crafting meticulously tailored wafers, designed to match your precise specifications for assured project success.
• Fast Turnaround : Benefit from our efficient processes and abundant inventory, allowing us to expedite delivery and keep your projects seamlessly on track.
• Global Reach : Our global shipping capabilities from our China and Japan warehouses enable us to serve a diverse clientele in over 50 countries, ensuring international satisfaction.

Dummy wafers (also known as test wafers) primarily serve experimental and testing purposes, distinct from general product wafers.
As a result, reclaimed wafers are frequently utilized as dummy wafers (test wafers).

Dummy wafers are crucial in production setups for initial safety enhancement and conducting delivery checks and process evaluations.
Given their frequent use in experiments and tests, the size and thickness of dummy wafers are critical considerations.

Wafers processed with a film deposition are termed film wafers.
Examples of film used for growth include isolation films as layer separators, metal films for conductivity, and essential process materials like resist and protective films.

Product Parameters

 

Use reference value

Item	Specification
Diameter	150mm	200mm	300mm
Type	P/N	P/N	P/N
Notch	SEMI/JEIDA	Notch/OF	Notch
Thickness(μm)	675±25/625±25	725±25	725±25
Surface	Polished	Polished	Polished
Inside	Etched	Etched	Etched
Package	CoinRoll	CoinRoll	CoinRoll

 

150MM/200MM Test Wafer: Our premium test wafers, available in both 150MM and 200MM sizes, cater to your advanced testing requirements, ensuring precision and reliability.

150MM
SPEC	0.2um≤30ea
Diameter(mm)	150±0.2mm
Type	P
Olyfra length	57.5mm±2.5mm	47.5mm±2.5mm
Resistance value ( Ω·cm )	1-100
Thickness(μm)	SEMI	JEIDA
	675um±25um	675um±25um
TTV(μm)	≤30um
BOW(μm)	≤40um
WARP(μm)	≤40um
Surface impurity	≤5.0E 10 atom/cm²

 

200MM
SPEC	0.2um≤30ea	-
Diameter(mm)	200±0.2mm
Type	P
Crystal orientation	<110>±1
Notch direction
Resistance value ( Ω·cm )	1-100
Thickness(μm)	725um±25um
TTV(μm)	≤25um	≤2um
BOW(μm)	≤40um
WARP(μm)
LM	NO
Surface impurity	≤5.0E 10 atom/cm²

 

300MM Test Wafer: Experience unmatched quality with our 300MM test wafers, designed for superior performance in rigorous testing environments.

300MM
SPEC	0.045um≤50ea	0.065um≤50ea	0.09um<50ea	0.12um<50ea
Manufacturing method	CZ
Diameter(mm)	300±0.2mm
Type/Dopant	P/Boron
Crystal orientation	<100>±1
Notch direction
Resistance value (Ω·cm)	1-100
Thickness(μm)	775±25
TTV(μm)	≤10
BOW(μm)	≤40
WARP(μm)
LM	T7+ OCR
Surface impurity	<1 E10 Atoms/cm²

 

200MM/300MM Oxide Wafer: Choose from our 200MM and 300MM oxide wafers, tailored for exceptional integration into your production processes.
 

	200MM	300MM
Oxide thickness	500±25nm
Variation in oxide thickness (for one wafer)	<3%
Variation in oxide thickness (for multiple wafers)	<3%
SPEC	0.2μm≤30ea
Diameter(mm)	200±0.2mm	300±0.2mm
Type	P
Crystal orientation	<100>±1
Notch direction	<100>±1
Resistance value (Ω ·cm)	1-100
Thickness(μm)	725±25
TTV(μm)	≤25	≤10
BOW(μm)	≤40
WARP(μm)	≤40
Surface impurity	≤5.0 E10 Atom/cm²	<1 E10 Atoms/cm²

 

* Please contact us for other film types, film thickness, and film composition. We are here to assist you with customized solutions and expert guidance to perfectly suit your specific needs.
 

Certifications

 

Packaging & Shipping

 

Company Profile

 

Fine Silicon Manufacturing (Shanghai) Ltd. embarked on its journey in August 2008, and since then, it has been at the forefront of innovation. Nestled in the heart of Shanghai's vibrant Pudong New Area, we house a state-of-the-art wafer reclaim factory, specializing in the meticulous lapping and polishing of 6-12 inch wafers. Our facility boasts an impressive production capacity of 50,000 pieces each month, ensuring we meet the demands of our esteemed clientele. Furthermore, we proudly serve as agents for particle-controlled test wafer reclamation, advanced wafer film coating, and precision wafer thinning. If our pioneering solutions intrigue you, we invite you to CONTACT US for further information and discover how we can enhance your technological endeavors.

 

 

Our Advantages

 

FAQ

 

Q: What is the preferred method for shipping?
A: We proudly offer a variety of shipping options including DHL, FedEx, TNT, UPS, EMS, SF, and others, ensuring your order arrives swiftly and safely.
Q: What payment methods are available?
A: We accept payments through T/T and PayPal, among others.
Q: What is the delivery timeframe?
A: For items readily in stock, expect delivery within 5 business days.
For custom orders, delivery times range from 7 to 25 business days, depending on the order quantity.
Q: Can the products be tailored to my specific needs?
A: Absolutely! We offer customization of materials, specifications, and optical coatings to match your exact requirements for optical components.

Every customer's specifications are unique, and Fine Silicon Manufacturing can deliver wafers that align perfectly with your precise needs.

If you do not see the specification you require, pleaseCONTACT FSMto consult with our experienced and knowledgeable sales team for assistance.