| Customization: | Available |
|---|---|
| Material: | Borosilicate Glass (Borofloat 33) |
| Frront Side: | Polished |
|
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FSM introduces the 4″ (100mm) Borofloat Glass Wafer, a high-quality substrate material ideal for a wide range of applications in the semiconductor and electronics industries. Borofloat glass is a borosilicate glass known for its excellent thermal properties, chemical resistance, and mechanical stability. These wafers are perfect for applications requiring a robust, yet transparent material.
| Specification | Value |
|---|---|
| Material | Borosilicate Glass (Borofloat 33) |
| Diameter | 150mm ± 0.2mm |
| Surface Quality | Scratch-Dig 40/20 |
| BOW | ≤25µm |
| WARP | ≤25µm |
| TTV | ≤5µm |
| Thermal Properties | Low coefficient of thermal expansion |
| Chemical Resistance | High resistance to water, acids, and organic substances |
| Transparency | High transparency in the visible and near-infrared spectrum |
| Packaging | Cleanroom packed, individual cassettes |
FSM's 4-inch Borofloat glass wafers are versatile and can be used in various high-tech applications, including:
Our commitment to quality ensures that our Borofloat glass wafers provide the reliability and performance necessary for cutting-edge technology development.
FSM offers competitive pricing with quantity discounts for bulk orders. For orders of 100 wafers or more, please contact us to discuss customized pricing options tailored to your project's volume requirements.
Use reference value
| Item | Specification | ||
| Diameter | 150mm | 200mm | 300mm |
| Type | P/N | P/N | P/N |
| Notch | SEMI/JEIDA | Notch/OF | Notch |
| Thickness(μm) | 675±25/625±25 | 725±25 | 725±25 |
| Surface | Polished | Polished | Polished |
| Inside | Etched | Etched | Etched |
| Package | CoinRoll | CoinRoll | CoinRoll |
150MM/200MM Test wafer
| 150MM | ||
| SPEC | 0.2um≤30ea | |
| Diameter(mm) | 150±0.2mm | |
| Type | P | |
| Olyfra length | 57.5mm±2.5mm | 47.5mm±2.5mm |
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | SEMI | JEIDA |
| 675um±25um | 675um±25um | |
| TTV(μm) | ≤30um | |
| BOW(μm) | ≤40um | |
| WARP(μm) | ≤40um | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
| 200MM | ||
| SPEC | 0.2um≤30ea | - |
| Diameter(mm) | 200±0.2mm | |
| Type | P | |
| Crystal orientation | <110>±1 | |
| Notch direction | ||
| Resistance value ( Ω·cm ) | 1-100 | |
| Thickness(μm) | 725um±25um | |
| TTV(μm) | ≤25um | ≤2um |
| BOW(μm) | ≤40um | |
| WARP(μm) | ||
| LM | NO | |
| Surface impurity | ≤5.0E 10 atom/cm² | |
| 300MM | ||||
| SPEC | 0.045um≤50ea | 0.065um≤50ea | 0.09um<50ea | 0.12um<50ea |
| Manufacturing method | CZ | |||
| Diameter(mm) | 300±0.2mm | |||
| Type/Dopant | P/Boron | |||
| Crystal orientation | <100>±1 | |||
| Notch direction | ||||
| Resistance value (Ω·cm) | 1-100 | |||
| Thickness(μm) | 775±25 | |||
| TTV(μm) | ≤10 | |||
| BOW(μm) | ≤40 | |||
| WARP(μm) | ||||
| LM | T7+ OCR | |||
| Surface impurity | <1 E10 Atoms/cm² | |||
| 200MM | 300MM | |
| Oxide thickness | 500±25nm | |
| Variation in oxide thickness (for one wafer) |
<3% | |
| Variation in oxide thickness (for multiple wafers) |
<3% | |
| SPEC | 0.2μm≤30ea | |
| Diameter(mm) | 200±0.2mm | 300±0.2mm |
| Type | P | |
| Crystal orientation | <100>±1 | |
| Notch direction | <100>±1 | |
| Resistance value (Ω ·cm) | 1-100 | |
| Thickness(μm) | 725±25 | |
| TTV(μm) | ≤25 | ≤10 |
| BOW(μm) | ≤40 | |
| WARP(μm) | ≤40 | |
| Surface impurity | ≤5.0 E10 Atom/cm² | <1 E10 Atoms/cm² |
Q: What's the way of shipping ?
A: We accept DHL, Fedex, TNT, UPS, EMS, SF and etc.
Q: How to pay?
A: T/T, PayPal and etc..
Q: What's the deliver time?
A: For inventory: the delivery time is 5 workdays.
For customized products: the delivery time is 7 to 25 workdays. According to the quantity.
Q: Can I customize the products based on my need?
A: Yes, we can customize the material, specifications and optical coating for your optical components based on your needs.
Every customer's specification is unique and FSM can supply wafers that meet your exact specifications.
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